BESI VIET NAM
Mức lương
12 - 18 triệu
Hạn nộp hồ sơ
01/11/2024
  • Kinh nghiệm: Từ 2 - 3 năm
  • Chức vụ: Nhân viên
  • Yêu cầu bằng cấp: Cao đẳng
  • Số lượng cần tuyển: 1
  • Yêu cầu giới tính: Nam, Nữ
  • Độ tuổi: từ 24 - 35 tuổi
  • Hình thức làm việc: Toàn thời gian
MÔ TẢ CÔNG VIỆC

- Be in charge of AR & AP - Support for the month end closings and preparation of monthly financial statements. - Support for the timely preparation of monthly reporting package to Head Office. - Prepare journal entries and reconciles general ledger and subsidiary accounts of the financial statements. - Assist with the updating, implementing and maintaining the internal controls and introducing new systems and control where appropriate. - Responsible for the analyzing, accuracy and timeliness of month end financial accounts. - Responsible for the preparation and submission of statutory accounts and tax submissions; liaising with the external auditors and tax agent - Any other activities related to the financial activities of the company. - Liaise with the local management in Vietnam as well as other Besi Sites and global finance teams.

QUYỀN LỢI ĐƯỢC HƯỞNG

- Guaranteed 13th month salary, annual KPI bonus - Health insurance for staff and dependent (spouse/ children) - Birthday gift, married congratulation, childbirth congratulation... - 14 AL days/ year + 6 paid sick leave days, 1 extra AL after 1 completed year

YÊU CẦU CÔNG VIỆC

- College or bachelor graduation - Experience in manufacturing field - Experience in working on SAP is an advantage - At least 2 year experience in relevant job with system mindset - Strong knowledge on local accounting

CÁCH NỘP HỒ SƠ

Cách 1: Nộp hồ sơ trực tiếp tại văn phòng:

Địa chỉ: Lot I-15-1, Street D12, Tang Nhon Phu B, Saigon Hi-Tech Park, Thành Phố Thủ Đức, Hồ Chí Minh

Cách 2: Nộp hồ sơ qua email:

Bấm vào nút "Ứng tuyển ngay" để nộp

Chia sẻ công việc
GIỚI THIỆU CÔNG TY

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.